BONDexpo, Stuttgart in September 2010
A separate trade fair for the Industrial Bonding Technologies!
BONDexpo is an International trade fair for Industrial Bonding Technology, the complete technology for bonding and joining parts.
Why a separate trade fair for the "bonding technologies market"? Because this is the only way to exploit many advantages offered by bonding.
Bonding involves a lot more than simßply connecting different materials with diverse surface structures. Adhesives seal and insulate, serve as joint sealing compounds and turn a variety of materials into highly-resistant composite materials.
Users will receive objective answers to these targeted questions from the exhibitors at the 4th BONDexpo.
We look forward to meeting you at our stand 7501-1, hall 7 from the 13. to 16. September 2010.
